JPH06228Y2 - レーザ加工機の静電容量センサ - Google Patents
レーザ加工機の静電容量センサInfo
- Publication number
- JPH06228Y2 JPH06228Y2 JP1988165834U JP16583488U JPH06228Y2 JP H06228 Y2 JPH06228 Y2 JP H06228Y2 JP 1988165834 U JP1988165834 U JP 1988165834U JP 16583488 U JP16583488 U JP 16583488U JP H06228 Y2 JPH06228 Y2 JP H06228Y2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- flange portion
- sensor
- capacitance sensor
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 241000227287 Elliottia pyroliflora Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165834U JPH06228Y2 (ja) | 1988-12-23 | 1988-12-23 | レーザ加工機の静電容量センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165834U JPH06228Y2 (ja) | 1988-12-23 | 1988-12-23 | レーザ加工機の静電容量センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0287575U JPH0287575U (en]) | 1990-07-11 |
| JPH06228Y2 true JPH06228Y2 (ja) | 1994-01-05 |
Family
ID=31452681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988165834U Expired - Lifetime JPH06228Y2 (ja) | 1988-12-23 | 1988-12-23 | レーザ加工機の静電容量センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06228Y2 (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9004335U1 (de) * | 1990-04-14 | 1990-07-26 | Trumpf GmbH & Co, 7257 Ditzingen | Aufnahmevorrichtung für eine Düse, insbesondere eines Laserschneidkopfes |
| DE4028338A1 (de) * | 1990-09-06 | 1992-03-12 | Weidmueller C A Gmbh Co | Duese fuer ein werkzeug zur materialbearbeitung |
| US5500504A (en) * | 1990-11-07 | 1996-03-19 | C. A. Weidmuller Gmbh & Co. | Nozzle for a tool for the working of material |
| US11389907B2 (en) | 2018-12-03 | 2022-07-19 | Mitsubishi Electric Corporation | Laser machining apparatus and laser machining method |
-
1988
- 1988-12-23 JP JP1988165834U patent/JPH06228Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0287575U (en]) | 1990-07-11 |
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